Publication

Byline

Location

US Patent Issued to Infineon Technologies on June 23 for "Test signal circuit for testing a radio frequency receiver circuit, a semiconductor chip and a system comprising the test signal circuit" (Austrian, German Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,663,459, issued on June 23, was assigned to Infineon Technologies AG (Neubiberg, Germany). "Test signal circuit for testing a radio frequency r... और पढ़ें


US Patent Issued on June 23 for "Apparatus for testing electronic devices" (South Korean Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,663,460, issued on June 23. "Apparatus for testing electronic devices" was invented by SeungHyeon Jeong (Chuncheon, South Korea), HunTaek Lee (... और पढ़ें


US Patent Issued to Taiwan Semiconductor Manufacturing on June 23 for "System for thermal testing a wafer chuck and methods for performing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,663,461, issued on June 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "System for thermal testing a wafer ... और पढ़ें


US Patent Issued to NXP USA on June 23 for "On-chip fault detection due to malfunctions on chip pins" (American, Indian Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,663,462, issued on June 23, was assigned to NXP USA Inc. (Austin, Texas). "On-chip fault detection due to malfunctions on chip pins" was invent... और पढ़ें


US Patent Issued to Tektronix on June 23 for "Split-path multiplexing accessory for a test and measurement instrument" (Oregon Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,663,463, issued on June 23, was assigned to Tektronix Inc. (Beaverton, Ore.). "Split-path multiplexing accessory for a test and measurement ins... और पढ़ें


US Patent Issued to Rohm on June 23 for "Semiconductor integrated circuit device and vehicle" (Japanese Inventor)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,663,464, issued on June 23, was assigned to Rohm Co. Ltd. (Kyoto, Japan). "Semiconductor integrated circuit device and vehicle" was invented by... और पढ़ें


US Patent Issued to Tektronix on June 23 for "Test and measurement instrument accessory with reconfigurable processing component" (Oregon Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,663,465, issued on June 23, was assigned to Tektronix Inc. (Beaverton, Ore.). "Test and measurement instrument accessory with reconfigurable pr... और पढ़ें


US Patent Issued to MACOM Technology Solutions Holdings on June 23 for "Voice coil leaf spring prober" (New York Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,663,466, issued on June 23, was assigned to MACOM Technology Solutions Holdings Inc. (Lowell, Mass.). "Voice coil leaf spring prober" was inven... और पढ़ें


US Patent Issued to Test Research on June 23 for "Electrical testing equipment" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,663,467, issued on June 23, was assigned to Test Research Inc. (Taipei City, Taiwan). "Electrical testing equipment" was invented by Yi Tsao (T... और पढ़ें


US Patent Issued to NXP on June 23 for "System and method for detecting faults in integrated circuits" (German, Swiss, Indian Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,663,468, issued on June 23, was assigned to NXP B.V. (Eindhoven, Netherlands). "System and method for detecting faults in integrated circuits" ... और पढ़ें